{"product_id":"hpe-c3000-c7000-interconnect-filler-module-414053-001","title":"HPE C3000 \u0026 C7000 Interconnect Filler Module | 414053-001","description":"\u003cdiv class=\"product-section container jc-between-center is-flex-row\"\u003e \u003cdiv class=\"twelve columns medium-down--one-whole-NG product-section-extras quick-specs\"\u003e \u003cdiv class=\"one-whole columns quick-specs-data\"\u003e \u003cdiv class=\"hfour\"\u003eQuick Specs\u003c\/div\u003e \u003cul class=\"margin-empty margin-bottom\"\u003e\n\u003cli\u003e\n\u003cb\u003eType\u003c\/b\u003e: Interconnect bay filler blank\u003c\/li\u003e \u003cli\u003e\n\u003cb\u003eEnclosure Compatibility\u003c\/b\u003e: HPE BladeSystem C3000 and C7000\u003c\/li\u003e \u003cli\u003e\n\u003cb\u003ePurpose\u003c\/b\u003e: Maintains airflow and thermal balance\u003c\/li\u003e \u003cli\u003e\n\u003cb\u003eInstallation\u003c\/b\u003e: Tool-less, snap-in design\u003c\/li\u003e \u003cli\u003e\n\u003cb\u003eUse Case\u003c\/b\u003e: Blocks empty interconnect bays when no module is present\u003c\/li\u003e \u003cli\u003e\n\u003cb\u003eMaterial\u003c\/b\u003e: Durable plastic construction\u003c\/li\u003e \u003c\/ul\u003e \u003c\/div\u003e \u003c\/div\u003e \u003cdiv class=\"four-NG medium-down--one-whole-NG product-section-extras ideal-for\"\u003e \u003cdiv class=\"hfour\"\u003ePart Number:\u003c\/div\u003e \u003cul\u003e \u003cli\u003e414053-001\u003c\/li\u003e \u003c\/ul\u003e \u003c\/div\u003e\n\u003c\/div\u003e\u003cdiv class=\"sixteen column\"\u003e\n\u003cdiv class=\"eight medium-down--one-whole-NG \"\u003e\u003cp\u003eThe HPE C3000 \u0026amp; C7000 Interconnect Filler Module is a precision-designed blank used to fill empty interconnect bays in BladeSystem enclosures. It helps maintain proper airflow and cooling efficiency by blocking open slots where interconnect modules, such as switches or pass-throughs, are not installed. This passive component is critical in preserving thermal balance inside the chassis.\u003c\/p\u003e\u003c\/div\u003e\n\u003cdiv class=\"eight medium-down--one-whole-NG \"\u003e\u003cp\u003eIdeal for both C3000 and C7000 enclosures, this interconnect filler is easy to install and remove without tools. It ensures that airflow is directed over active components instead of escaping through unused bays, which helps prevent overheating and improves system reliability. Use of filler blanks is an HPE-recommended best practice in any partially populated blade enclosure.\u003c\/p\u003e\u003c\/div\u003e\n\u003c\/div\u003e","brand":"HPE","offers":[{"title":"Default Title","offer_id":48888069357785,"sku":"414053-001","price":79.98,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0016\/5327\/6707\/files\/414053-001.jpg?v=1783205401","url":"https:\/\/www.aloinfo.com.co\/pt-br\/products\/hpe-c3000-c7000-interconnect-filler-module-414053-001","provider":"aloinfousa.com","version":"1.0","type":"link"}